Optimized Thermal Simulation Model of Multilayer Printed Circuit Board
Optimized Thermal Simulation Model of Multilayer Printed Circuit Board
Author(s): Michal Frivaldsky, Pavol Spanik, Ján Morgoš, Norbert GlapaSubject(s): Energy and Environmental Studies, Methodology and research technology
Published by: Žilinská univerzita v Žilině
Keywords: multilayer printed circuit board; thermal modeling; approximation; simulation;
Summary/Abstract: Very thin multi-layers of Cu and epoxy compound in PCB (printed circuit board) make difficult to design computational meshes in finite element method simulation programs. Number of degrees of freedom in simulated system rapidly increases – it significantly extends simulation computational time. In this paper we propose substitution of the PCB in axial and radial direction with the composite structure with equivalent physical parameters of multilayer PCB.
Journal: Komunikácie - vedecké listy Žilinskej univerzity v Žiline
- Issue Year: 20/2018
- Issue No: 1
- Page Range: 78-81
- Page Count: 4
- Language: English
