Connecting Copper Wire to Thin Metal Layers
Connecting Copper Wire to Thin Metal Layers
Author(s): Paštéka Michael, Marian Králik, Hladiš PeterSubject(s): ICT Information and Communications Technologies
Published by: UIKTEN - Association for Information Communication Technology Education and Science
Keywords: electrical bond; connecting; thin metal layers; weld; pressure
Summary/Abstract: The process or a system of creating connection between two electrical conductive materials is referred to as heat bonding. In this case it is correct to call it micro bonding. Essential characteristics of this process are pressing two materials together and applying heat. Similar processes are used to create connections to LCDs (Liquid crystal displays) or PCB. This paper discusses copper wire bonding technology to a thin metal layer made on dielectric sheet for micro coils.
Journal: TEM Journal
- Issue Year: 8/2019
- Issue No: 3
- Page Range: 728-732
- Page Count: 5
- Language: English
