Design of Printed Circuit Board Production using Water Jet Technology Cover Image

Design of Printed Circuit Board Production using Water Jet Technology
Design of Printed Circuit Board Production using Water Jet Technology

Author(s): Peter Gajdovcik, Dominika Lehocka, Darina Dupláková, Frantisek Botko, Libor Sitek
Subject(s): Business Economy / Management, ICT Information and Communications Technologies
Published by: UIKTEN - Association for Information Communication Technology Education and Science
Keywords: Printed circuit boards; water jet; conductive pattern; hole;proposal;

Summary/Abstract: Printed circuit boards are part of electronic devices and affect the functioning of today's society. At present, printed circuit boards are manufactured for relatively long periods of time using the same methods. The presented article focuses on the design of the possibility which eliminates errors arising from the development and etching of PCBs. It describes the theoretical design of the use of hydrodynamic continuous water jet machining in PCB production. The proposal points to the possibility of using positive water jet properties are as such: no heat-affected zone, thin separation gap, absence of dust particles and toxic fumes.

  • Issue Year: 8/2019
  • Issue No: 4
  • Page Range: 1313-1318
  • Page Count: 6
  • Language: English
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